lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 1 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 1. scope this specification applies for the lead - free smd resettable fuse series . 2. construction 3. type designation trf smd resettable fuse v06 vmax(vdc) 035 i - hold 035 : 0.35 a f 2 lead free v 0 6 : 6 v v08: 8v v12: 12v v13: 13.2v v 15 : 15 v v 1 6 : 1 6 v v30: 30v v60: 60v 10 size 10:0805 ( 2012 ) e packaging e:embossed tape t:paper tape
lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 2 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 4. dimensions dimensions u nit : mm packaging: 3000 pcs. per reel. 5. applications and ratings part d designation min. max. min. max. min. max. min. TRF10-010V15-EF 2.00 2.30 1.20 1.50 0.48 0.85 0.20 trf10-020v09-ef 2.00 2.30 1.20 1.50 0.48 0.85 0.20 trf10-035v06-ef 2.00 2.30 1.20 1.50 0.48 0.85 0.20 trf10-050v06-ef 2.00 2.30 1.20 1.50 0.48 0.85 0.20 trf10-075v06-ef 2.00 2.30 1.20 1.50 0.75 1.25 0.20 trf10-110v06-ef 2.00 2.30 1.20 1.50 0.75 1.25 0.20 a b c i hold i trip p d part v max i max at 23 designation (vdc) (a) (a) (a) (w) curren t time ri min r1 max (a) (sec) ( TRF10-010V15-EF 15 40 0.10 0.3 0.5 0.5 1.5 1 7.5 trf10-020v09-ef 9 40 0.20 0.5 0.5 8 0.02 0.65 3.5 trf10-035v06-ef 6 40 0.35 0.75 0.5 8 0.1 0.25 1.2 trf10-050v06-ef 6 40 0.50 1 0.5 8 0.1 0.15 0.9 trf10-075v06-ef 6 40 0.75 1.5 0.6 8 0.2 0.09 0.35 trf10-110v06-ef 6 40 1.10 2.2 0.6 8 0.3 0.06 0.21 maximum time to trip at 23 resistance at 23 i hold = hold current. maximum current device will sustain for 30min without tripping in 23c still air. i trip = trip current. minimum current at which the device will trip in 23c still air. v max = maximum voltage device can withstand without damage at rated current. i max = maximum fault current device can withstand without damage at rated voltage. p d = power dissipated from device when in the tripped state at 23c still air. ri min = typical resistance of device in initial (un-soldered) state. r1 max = maximum resistance of device at 23c measured one hour post reflow.
lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 3 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 6. thermal derating chart 7. typical time to trip at 23 c the time to trip curves represent typical performance of a device in a simulated application environment. actual performance in specific customer applications may differ from these values due to the influence of other variables. part designation -40 -20 0 23 40 50 60 70 85 TRF10-010V15-EF 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05 trf10-020v09-ef 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 trf10-035v06-ef 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 trf10-050v06-ef 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 trf10-075v06-ef 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.42 0.35 trf10-110v06-ef 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 maximum ambient operating temperature(t mao ) vs. hold current (i hold ) (amps)
lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 4 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 8. e nvironment 8.1 operating conditions operating temperature : - 40 125 test item condition resistance change passive aging 85 ,1000hr 5% typical humidity aging 85 ,85%r.h,1 000 hr 5% typical thermal shock 85 to - 40 ,20times 10 % typical resistance to solvent mil - std - 202,method215 no change vibration mil - std - 883c ,method20 07.1 condition a no change 8.3 solder reflow recommendations ? recommend reflow methods : ir, vapor phase oven, hot air oven. ? ? ?
lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 5 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 9. typi cal part marking represents total content. layout may vary. 10. storage conditions : temperature : 40 max , humidity : 4 0 %~70% 11. shelf life: 2 year s from manufacturing date
lead free smd resettable fuse document no trf 1 0 os00 0 a issued date 2009/01/10 page 6 / 7 ta - i technology co., ltd specifications are subject to change without notice. customers should verify a ctual device performance in their specific applications. 12. taping & reel
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